TIRF芯片设计的无线模块材料

[{"title":"（7个子文件2.11MB）TIRF芯片设计的无线模块资料","children":[{"title":"pdf文件","children":[{"title":"cc1101tr4.pdf <span style='color:#111;'>2.49MB</span>","children":null,"spread":false},{"title":"cc1101tr4s.pdf <span style='color:#111;'>1.90MB</span>","children":null,"spread":false},{"title":"cc1101trs4.GIF <span style='color:#111;'>8.70KB</span>","children":null,"spread":false},{"title":"Thumbs.db <span style='color:#111;'>26.00KB</span>","children":null,"spread":false},{"title":"cc1101tr4.GIF <span style='color:#111;'>8.76KB</span>","children":null,"spread":false},{"title":"未命名.JPG <span style='color:#111;'>58.55KB</span>","children":null,"spread":false},{"title":"未命名.bmp <span style='color:#111;'>489.99KB</span>","children":null,"spread":false}],"spread":true}],"spread":true}]